Prediction of Real Contact Area from Microtopography on CMP Pad
نویسندگان
چکیده
منابع مشابه
A Material Removal Model for CMP Based on the Contact Mechanics of Pad, Abrasives, and Wafer
Applied pressure in chemical mechanical polishing CMP is shared by the two-body pad–wafer and the three-body pad–abrasive– wafer contacts. The fraction of applied pressure transferred through the particle contacts is a significant factor as most of the material removal is due to abrasive particles trapped in the pad–wafer interface. In this work, the contact of a rough, deformable pad and a smo...
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ژورنال
عنوان ژورنال: Journal of Advanced Mechanical Design, Systems, and Manufacturing
سال: 2012
ISSN: 1881-3054
DOI: 10.1299/jamdsm.6.113